LOW LOSS LOW-K DIELECTRIC MATERIAL

LOW LOSS LOW-K DIELECTRIC MATERIAL
Eccostock LoK is a low dielectric constant, low loss and low weight thermosetting plastic for RF and microwave insulation. It weighs only about half that of polystyrene and one quarter that of polytetrafluorethylene.
Eccostock LoK has better dimensional stability than other low loss plastics. It will not cold flow, nor will it flow when heat is applied. Soldering iron temperatures will not soften Eccostock LoK, only slightly degrade in the immediate area of contact.
It is completely unicellular and is unaffected by moisture.

FEATURES AND BENEFITS
• Low dielectric constant
• Lightweight
• Good dimensional stability

MARKETS
• Commercial Telecom
• Security and Defense

APPLICATIONS
• Eccostock LoK is specifically designed for use in coaxial, waveguide and antenna support problems. Due to the low dielectric constant, reflections in transmission lines are minimized.
• RF coils wound on Eccostock LoK exhibit higher Q than when wound on polystyrene or other plastic stock.

AVAILABILITY
• Eccostock LoK is available in the following standard sizes:
• Sheets 30.5 x 30.5cm (12” x 12”) in thicknesses of 0.32, 0.64, 0.95, 1.27, 1.59, 1.91, 2.54, 3.81,5.08, 6.35 & 7.62 cm (1/8, 1/4, 3/8, 1/2, 5/8, 3/4, 1.0, 1.5, 2.0, 2.5 & 3.0”)
• Rods 30.5 cm (12”) long in diameters of 0.32, 0.64, 0.95, 1.27, 1.59, 1.91, 2.54, 3.81, 5.08, 6.35 & 7.62 cm (1/8, 1/4, 3/8, 1/2, 5/8, 3/4, 1.0, 1.5, 2.0, 2.5 & 3.0”).
• Bars 30.5 cm (12”) long in squares of 0.64, 0.95, 1.27, 1.59, 1.91, 2.54, 3.81 & 5.08 cm (1/4, 3/8, 1/2, 5/8, 3/4, 1.0, 1.5 & 2.0”). Other sizes, shapes, thicknesses, and configurations are available on special order.