Emerson & Cuming 

Company Profile:
ECMP (Emerson & Cuming Microwave Products, Inc.)
Founded in 1948 and acquired by Laird Technologies in March 2012, ECMP is a global pioneer in the development and production of microwave absorbers, low-loss dielectric materials, and conductive shielding solutions. For decades, ECMP has delivered cutting-edge materials and engineered solutions to industries including wireless/satellite communications, automotive systems, and medical technology, with exceptional expertise in custom component design to meet specialized requirements.

Core Products:

1. ECCOSORB® Microwave Absorbing Materials

   • Free-Space Absorbers (Broadband/Narrowband):

     • (1) Narrowband Free-Space:

       • ECCOSORB Sf: Silicone-based absorbers (1–18GHz), offering >20 dB attenuation at center frequencies.

     • (2) Broadband Free-Space:

       • ECCOSORB AN: Multi-layer carbon-impregnated polyurethane foam sheets (0.6–40GHz).

   • Surface Current Suppression/Cavity Resonance Reduction:

     • (1) ECCOSORB MCS: Silicone-based (0.8–18GHz), optional adhesive backing.

     • (2) ECCOSORB GDS: Silicone-based (6–35GHz), optional adhesive backing.

     • (3) ECCOSORB BSR: Silicone-based (6GHz to millimeter-wave), optional adhesive backing.

   • Load Absorbers:

     • (1) ECCOSORB MF: Rigid, magnetized, insulating epoxy (1GHz–110GHz).

     • (2) ECCOSORB CR: Semi-finished MF-series components; two-part magnetized castable epoxy.

2. ECCOSTOCK® Low-Loss Dielectric Materials for RF/Microwave Applications

   • Dielectric Constants: 1.03–30 (selectable).

   • Loss Tangents: As low as 0.0001.

   • Material Types: Flexible/rigid foams, thermoset composites, controlled-K materials, powders, and adhesives.

3. ECCOSHIELD® Conductive Shielding Materials

   • Product Range: Conductive gap-filling compounds, sheet materials, adhesives, and coatings for EMI suppression.

4. ECCOPAD® MetalTag®

   • Patented Ultra-Thin Synthetic Rubber: Isolation pads for metal-surface-readable smart tags (13.56/915MHz).