BONOTEC

Company Profile:

Bonotec Electronic Materials is a specialized manufacturer of ​electronic-grade adhesives and solutions, widely used in ​electronics assembly and ​semiconductor packaging.

Since 2009, Bonotec’s flagship ​ExBond™ die-attach adhesives and assembly materials have gained significant traction in the global electronics market, renowned for their ​exceptional performance and ​long-term stability. Leveraging proprietary, internationally advanced technology, Bonotec has resolved the traditional trade-off between bonding strength and application versatility, breaking the long-standing dominance of foreign brands and establishing itself as a ​leading domestic brand in electronic adhesives.

After 2011, Bonotec expanded its product lines to include the ​ExSilica™ silicone series and ​ExSeal™ sealing compounds. The company continues to collaborate with upstream and downstream partners to develop cutting-edge solutions for advanced packaging technologies. Moving forward, Bonotec will focus on ​platform innovation, ​product optimization, ​process control, ​quality assurance, and ​tailored technical services, delivering advanced materials and system solutions across industries. We eagerly collaborate with global partners to ​unlock new opportunities and drive superior outcomes.

Key Products:

Conductive Adhesives

- RFID 

- Room Temp Cure 

- Low Temp Cure 

- Fast Cure 

- High Heat Cond 

- High Reliability 

- High Stress Absorption 

- High Adhesion 高粘结力

Non-Conductive Adhesives

- UV Cure UV

- Underfill 

- am/Fill 

- Fast Cure 

- Low Temp Cure 

- Low Thermal Expansion 

- Fast/Snap Cure 

- High Reliability 

- Ageing Resistant 

- High Strength@HT