Chip Terminations

Key Features:

High Power Handling: Up to 300 W (pulsed/CW).
Broadband Performance: DC–18 GHz.
Surface-Mount Design: Compact integration for high-density RF circuits.
Powerfilm™ Technology: Precision thin/thick-film resistors for optimized RF power dissipation.

Technical Specifications:

Substrate Materials: BeO (Beryllium Oxide), Aluminum Nitride (AlN), or Alumina Ceramic (thermal/mechanical performance tailored to application).
Resistance Values: 50Ω and 100Ω (standard); custom values available.
Surface Finishes: Solderable, Silver, or Gold plating for reliable bonding.
Package Sizes: Multiple SMT-compatible dimensions.

Represented Brands：APITech


Model	Power (W)	Frequency (GHz)	Ceramic substrate	Resistive film	Packaging options	Complete the options	Width	Length	Height
12NPC30-60Z	10	12.0	BeO	TaN	Z	G, N, T, H	0.030	0.060	0.010
12NPC50-100EG	20	12.0	BeO	TaN	G	G, N, T, H	0.050	0.100	0.015
18NPC50-100G	20	18.0	BeO	TaN	G	G, N, T, H	0.050	0.100	0.010
ANC100-200	10	2.0	AlN	Thin	G, Z	N, T, H	0.100	0.200	0.040
ANC100-200AG	25	7.0	AlN	Thin	G	N, T, H	0.100	0.200	0.040
ANC200-200	30	4.0	AlN	Thin	G	N, T, H	0.200	0.200	0.040
ANC200-200AG	80	4.0	AlN	Thin	G	N, T, H	0.200	0.200	0.040
ANC250-250-40	40	2.5	AlN	Thin	G	N, T, H	0.250	0.250	0.040
ANC250-250-80	80	1.0	AlN	Thin	G, Z	N, T, H	0.250	0.250	0.040
ANC250-250BZ	16	2.0	AlN	Thin	Z	N, T, H	0.250	0.250	0.040
ANC250-375	150	3.0	AlN	Thin	G	N, T, H	0.250	0.375	0.040
ANC350-225	100	2.0	AlN	Thin	G	N, T, H	0.350	0.225	0.040
ANC350-225AG	150	4.0	AlN	Thin	G	N, T, H	0.225	0.350	0.040
ANC350-225AG2	100	3.0	AlN	Thin	G	N, T, H	0.350	0.225	0.040
ANC375-375	150	2.0	AlN	Thin	Z	N, T, H	0.375	0.375	0.040
ANC375-375	200	1.0	AlN	Thin	G	N, T, H	0.375	0.375	0.040
ANC375-375AG1	250	2.7	AlN	Thin	G	N, T, H	0.375	0.375	0.040
ANC50-100	10	2.5	AlN	Thin	G	N, T, H	0.050	0.050	0.010
ANC50-50	5	6.0	AlN	Thin	G	N, T, H	0.050	0.050	0.010
KAC100-200AG	30	2.3	AlN	Thick	G	N, T, H	0.100	0.200	0.040
KAC100-200AZ	20	2.0	AlN	Thick	Z	N, T, H	0.100	0.200	0.040
KAC250-250A	75	5.0	AlN	Thick	G, Z	N, T, H	0.250	0.250	0.040
KAC250-375AZ	100	3.0	AlN	Thick	Z	N, T, H	0.250	0.375	0.040
KAC350-225AG	125	3.0	AlN	Thick	G	N, T, H	0.350	0.225	0.040
KAC375-250AG	150	3.0	AlN	Thick	G	N, T, H	0.375	0.375	0.040
KAC375-375A	150	3.0	AlN	Thick	G, Z	N, T, H	0.375	0.375	0.040
KAC60-120A	10	4.0	AlN	Thick	G, Z	N, T, H	0.060	0.120	0.025
NPC20-40	3	18.0	BeO	TaN	G	G, N, T, H	0.020	0.040	0.010
NPC25-50	3	12.4	BeO	TaN	G	G, N, T, H	0.025	0.050	0.010
NPC50-100	10	4.0	BeO	TaN	G	G, N, T, H	0.050	0.100	0.010
NPC50-50	5	10.0	BeO	TaN	G	G, N, T, H	0.050	0.050	0.010
NPC75-150	15	4.0	BeO	TaN	G	G, N, T, H	0.075	0.150	0.010
PPC100-200A	20	4.0	BeO	Thin	G	N, T, H	0.100	0.200	0.040
PPC250-250A	40	2.5	BeO	Thin	G	N, T, H	0.250	0.250	0.040
PPC250-250AG	40	2.5	BeO	Thin	G	N, T, H	0.250	0.250	0.040
PPC250-250BG	100	1.5	BeO	Thin	G	N, T, H	0.250	0.250	0.060
PPC250-250BG1	75	7.0	BeO	Thin	G	N, T, H	0.250	0.250	0.060
PPC250-375A	150	1.0	BeO	Thin	G	N, T, H	0.250	0.375	0.040
PPC250-375AG2	200	2.7	BeO	Thin	G	N, T, H	0.250	0.375	0.040
PPC375-375AG	250	1.0	BeO	Thin	G	N, T, H	0.375	0.375	0.040
PPC375-375AG2	250	2.0	BeO	Thin	G	N, T, H	0.375	0.375	0.040
PPC375-375AG3	300	4.0	BeO	Thin	G	N, T, H	0.375	0.375	0.040

Chip Terminations

Key Features:

Technical Specifications:

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