T-gon 800 Series

The ​T-gon 800 Series is a ​high-performance, cost-effective thermal interface material designed for applications where ​electrical insulation is not required. Its ​unique grain orientation and layered structure allow it to conform precisely to surfaces, ​maximizing thermal transfer efficiency.

The T-gon 800 Series is supplied in ​12″ x 18″ (305 mm x 457 mm) or ​18″ x 24″ (457 mm x 610 mm) sheets, or as ​custom die-cut dimensions. A ​proprietary pressure-sensitive adhesive (PSA) can be applied to one side, featuring the ​thinnest adhesive layer available to minimize impact on thermal performance.

Features & Benefits:

• ​Thermal Conductivity:
  • ​5 W/mK in the Z-axis (through-plane).
  • ​140 W/mK in the X-Y plane (in-plane).
• ​Graphite Content: >98% for superior thermal stability.
• ​Low Thermal Resistance: Optimized for high-heat-flux scenarios.
• ​Thickness Options: 0.005″, 0.010″, 0.020″ (0.125 mm, 0.25 mm, 0.50 mm).

​Applications:

• ​Power Conversion Systems: Inverters, converters, and motor drives.
• ​Power Supplies: High-density thermal management.
• ​Telecom Switching Hardware: Heat dissipation in large-scale communication systems.
• ​Laptop Computers: Efficient cooling in compact electronics.

Represented Brands：Laird