T-PCM 900 Series

The ​T-PCM 900 Series is a ​high-performance, non-conductive thermal phase-change material. At ​50°C, T-PCM 900 softens and flows to fill microscopic irregularities at component interfaces, ​significantly reducing thermal resistance. At room temperature, it remains ​solid and self-supporting, eliminating the need for reinforcing layers that could compromise thermal performance.

After ​1,000 hours at 130°C or ​500 thermal shock cycles (-25°C to 125°C), T-PCM 900 exhibits ​no degradation in thermal performance. Notably, the material ​resists bleed-out (pump-out) during phase transition (see viscosity curve).

T-PCM 900 is supplied in ​rolls with top-side labeled release liners for manual or high-volume automated assembly. ​Custom die-cut parts are also available.

Key Features & Benefits:

• ​Thermal Resistance: ​0.03°C·in²/W for efficient heat transfer.
• ​Inherent Tackiness: Eliminates the need for additional adhesives.
• ​Long-Term Reliability: Stable under extreme thermal stress.
• ​Thickness Options: 0.005″, 0.010″, 0.020″ (0.125 mm, 0.25 mm, 0.50 mm).

Applications:

• ​Microprocessors: Thermal management in CPUs and GPUs.
• ​Chipsets: Heat dissipation in high-density ICs.
• ​Graphics Processing Units (GPUs): Cooling for high-performance computing.
• ​Custom ASICs: Tailored solutions for specialized electronics.
• ​Power Components & Modules: Inverters, IGBTs, and motor drives.

Represented Brands：Laird