T-Putty 502

T-Putty 502 is the premier ​thermal interface material (TIM) for applications with ​large gaps or wide tolerances, requiring compression ratios exceeding ​50% of the original thickness. Its flowable nature ensures ​low contact pressure on cooled components while delivering ​high thermal conductivity (3.0 W/mK) and ​extremely low thermal resistance.

T-Putty 502 features ​inherent tackiness, eliminating the need for additional adhesive coatings that could hinder thermal performance. With a ​Shore 00 hardness of 5, it is ​electrically insulating and maintains stable operation across a ​temperature range of -45°C to 200°C.

Key Features & Benefits:

• ​Soft & Highly Compressible: Ideal for low-stress applications with uneven surfaces.
• ​Thermal Conductivity: 3.0 W/mK for efficient heat dissipation.
• ​Thickness Range: Available in thicknesses from ​0.020″ (0.5 mm) to 0.200″ (5.0 mm).
• ​Self-Adhesive: No secondary bonding agents required.

​Applications:

• ​Cooling Components Mounted on Bases or Frames: Compensates for large assembly gaps.
• ​Large Printed Circuit Boards (PCBs): Thermal management in high-power electronics.
• ​Semiconductor Automated Test Equipment (ATE): Reliable heat transfer under cyclic loads.
• ​Low-Stress, High-Compression Scenarios: Ideal for delicate or uneven interfaces.

Represented Brands：Laird