T-Flex 600 Series

The ​T-Flex 600 Series is a ​high-compressibility thermal gap-filling material designed for demanding interfaces. Exceptionally soft and compressible, it achieves a ​thermal conductivity of 3.0 W/mK through patented ​boron nitride powder in its formulation. This combination of ​high thermal conductivity and ​extreme pliability results in ​ultra-low thermal resistance.

Due to its ultra-soft nature, T-Flex 600 can ​recover over 90% of its original thickness under low compression forces, ensuring reliable performance in low-pressure applications.

Key Attributes:

• ​Inherent Tackiness: Eliminates the need for adhesives that could degrade thermal efficiency.
• ​Electrically Insulating: Safe for use on live components.
• ​Wide Operating Range: Stable from ​**-45°C to 200°C** with ​UL 94HB flame-retardant certification.

Features & Benefits:

• ​Exceptional Compressibility Under Low Pressure: Ideal for irregular or uneven surfaces.
• ​Thermal Conductivity: 3.0 W/mK for efficient heat dissipation.
• ​Thickness Options: Available from ​0.020″ (0.5 mm) to 0.200″ (5.0 mm).
• ​Self-Adhesive: No bonding agents required.

​Applications:

• ​Cooling Components in Chassis or Frames: Compensates for large assembly gaps.
• ​High-Speed Mass Storage Drives: Thermal management in data centers.
• ​RDRAM Memory Modules: Heat dissipation in high-performance computing.
• ​Heat Pipe Thermal Solutions: Enhances thermal coupling efficiency.
• ​Automotive Engine Control Units (ECUs): Reliability under extreme temperatures.
• ​Telecommunication Hardware: Base stations and RF equipment.
• ​Optical Transmission Systems: Precision cooling for photonic devices.

Represented Brands：Laird