T-Flex 500

T-Flex 500 is a ​high-compressibility gap-filling thermal pad that delivers ​excellent thermal performance at a ​cost-effective price point. This ultra-soft interface pad conforms closely to components even under minimal pressure, ensuring optimal thermal contact.

Unique Advantages:

• ​Low Silicone Oil Bleed-Out: Engineered for minimal oil migration, outperforming conventional silicone-based materials.
• ​NASA Compliance: Meets ​NASA low outgassing standards for critical aerospace applications.
• ​Inherent Tackiness: Eliminates the need for adhesive coatings that degrade thermal efficiency.
• ​Electrical Insulation: Safe for use on live circuits, with stable performance from ​**-45°C to 200°C** and ​UL 94 V-0 flammability rating.

2.8 W/mK Thermal Gap Filler:

• ​High Compressibility, Low Cost: Ideal for budget-sensitive, high-performance applications.
• ​Low Thermal Resistance Under Compression: Maximizes heat transfer efficiency.
• ​Ultra-Low Silicone Bleed-Out: Maintains cleanliness in sensitive environments.
• ​19 Thickness Options: Ranging from ​0.020″ (0.5 mm) to 0.200″ (5.0 mm).
• ​Self-Adhesive: No secondary bonding agents required.

​Applications:

• ​Cooling Components on Chassis or Frames: Compensates for uneven surfaces.
• ​High-Capacity Storage Drives: Thermal management in servers and data centers.
• ​RDRAM Memory Modules: Heat dissipation in high-speed computing.
• ​Heat Pipe Thermal Solutions: Enhances thermal coupling in compact systems.
• ​Automotive Engine Control Modules (ECMs): Reliability under harsh conditions.
• ​Telecommunication Hardware: Base stations, routers, and RF equipment.

Represented Brands：Laird