T-Flex 300

T-Flex 300 is a ​unique composite material blending ​silicone gel and ​ceramic powder, engineered to balance ​softness, conformability, thermal resistance, and cost-effectiveness for high-speed computing and telecommunications applications.

Under ​50 psi pressure, T-Flex 300 achieves ​50% compression of its initial thickness. This high compliance allows it to conform like a "carpet" over components, enhancing thermal transfer. The material exhibits ​low permanent set, enabling ​reuse over multiple assembly cycles.

T-Flex 300 combines ​exceptional flexibility with ​reliable thermal performance. With a ​thermal conductivity of 1.2 W/mK, it delivers ​low thermal resistance even under minimal compression forces.

Metallized liners are available for easy placement, handling, and rework. Comparative testing shows T-Flex 300’s metallized liners ​outperform silicone-based alternatives in thermal performance. The ​low coefficient of friction of these liners also simplifies installation in ​sliding-fit assemblies, such as cards inserted into backplanes.

Key Features & Benefits:

• ​Outstanding Conformability: Adapts to irregular surfaces with minimal pressure.
• ​Thermal Conductivity: ​1.2 W/mK for efficient heat dissipation.
• ​Reusable Design: Minimal permanent deformation ensures longevity.
• ​Thickness Range: ​0.5 mm to 5 mm for versatile applications.
• ​Metallized Liner Option: Enhances thermal performance and ease of installation.

​Applications:

• ​Laptops and Desktops: Cooling for CPUs, GPUs, and chipsets.
• ​Telecom Equipment: Base stations, routers, and RF modules.
• ​Hard Disk Drives (HDDs): Thermal management in data storage.
• ​DVD Players: Heat dissipation in consumer electronics.
• ​Flat-Panel Displays: Thermal regulation for LED/LCD screens.
• ​Memory Storage Modules: RDRAM and high-speed memory solutions.
• ​Power Conversion Systems: Inverters, converters, and motor drives.

Represented Brands：Laird