T-Flex 200 V0 Series

The ​T-Flex 200 V0 Series is an ultra-soft thermal gap filler offering ​superior compressibility compared to other thermal interface materials. With a ​thermal conductivity of 1.1 W/mK and exceptional conformability, it minimizes thermal resistance. The ​alumina-filled formulation provides a cost-effective solution with moderate thermal performance.

T-Flex 200 V0 features ​inherent tackiness, eliminating the need for additional adhesives that could compromise thermal efficiency. It is ​electrically insulating, operates stably from ​**-40°C to 160°C**, and meets the ​UL 94 V-0 flammability rating.

Key Features & Benefits:

• ​Soft & Compressible: Ideal for low-pressure applications with uneven surfaces.
• ​Self-Adhesive: No secondary bonding agents required.
• ​Thermal Conductivity: ​1.1 W/mK for efficient heat dissipation.
• ​20 Thickness Options: Available from ​0.010″ (0.20 mm) to 0.200″ (5.00 mm).

​Applications:

• ​Cooling Components to Chassis/Frame Interfaces: Compensates for assembly gaps.
• ​Plasma Displays: Thermal management in high-resolution panels.
• ​High-Speed Mass Storage Drives: Heat dissipation in data centers.
• ​RDRAM Memory Modules: Cooling for high-performance computing.
• ​Heat Pipe Thermal Solutions: Enhances thermal coupling efficiency.
• ​Automotive Engine Control Units (ECUs): Reliability under extreme conditions.
• ​Wireless Communication Hardware: Base stations, routers, and RF modules.

Represented Brands：Laird