T-PLI 200 Series

The ​T-PLI 200 Series is our high-performance thermal gap filler, crafted through a ​unique boron nitride-silicone formulation that defines Laird Technologies’ cutting-edge thermal interface solutions.

T-PLI 200 combines ​exceptional thermal conductivity (6 W/mK) and ​superior conformability to deliver unparalleled low thermal resistance. The material ​absorbs vibrations and ​mitigates mechanical stress, minimizing component damage. It is ​electrically insulating, operates reliably from ​**-45°C to 200°C**, and meets the ​UL 94HB flammability rating.

Key Features & Benefits:

• ​Industry-Leading Thermal Performance: Optimized for high-heat-flux applications.
• ​Thermal Conductivity: ​6 W/mK for rapid heat dissipation.
• ​Ultra-Soft & Conformable: Adapts seamlessly to uneven surfaces.
• ​22 Thickness Options: Ranging from ​0.010″ (0.25 mm) to 0.200″ (5.0 mm).

​Applications:

• ​Laptops: Thermal management in ultra-thin designs.
• ​Handheld Mobile Devices: Cooling for compact electronics.
• ​Micro Heat Pipe Solutions: Enhances thermal coupling in miniaturized systems.
• ​Microprocessors, Memory Chips, and GPUs: Precision cooling for high-performance ICs.
• ​Automotive Engine Control Modules (ECMs): Reliability under extreme thermal cycling.
• ​Wireless Communication Hardware: Base stations, routers, and 5G infrastructure.

Represented Brands：Laird